Question

10) The "Bosch Process" is used for which of the following etching profiles?
O Reactive lon Etching
O Wet Etching
O Deep Reactive lon Etching
O None of the Above​

Answer 1

Answer:

The correct answer is Deep Reactive Ion Etching. The 'Bosch Process' is used for the Deep RIE etching profiles.

Explanation:

The Bosch process mainly works in two modes:

1. Isotropic plasma etch( which is standard).

2. Deposition of a passivation layer( which is basically inert)- prevents further etching.

The Deep Reactive Ion Etching was mainly developed for facilitating Microelectromehanical systems or MEMS.