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The present invention relates to a photocurable resin composition,
The composition comprises (A) at least one polyol compound selected from the group comprising (a) polyester polyols and polycarbonate polyols, (b) polyisocyanate compounds, and (c) hydroxy group-containing (meth) acryl Urethane (meth) acrylate oligomers obtained by the reaction of a rate compound; (B) (meth) acryloyl phosphate; (C) a polyfunctional (meth) acrylate compound; And (D) a photopolymerization initiator, which exhibits a rapid curing rate, and wherein the cured product obtained from the composition exhibits excellent adhesion and metal corrosion under high temperature and high humidity conditions.
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