Applications of tinning process
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The manufacturing method of HOT-DIP tinning is pollution-free, and is suitable for recycling. Since HOT-DIP tin-plated are environmentally friendly, we started full scale production from 1996.
The characteristics of HOT-DIP tinning are excellent in corrosion resistance and solderability; therefore, it has been used extensively in automobiles, electrical and electronic components since the 1970s in Europe and the U.S., and in recent years, it has been used by Japanese automobile manufacturers as well.
By the metallic bonding between the melted tin and phosphor bronze, a middle alloy layer which completely covers the base material is formed between the base phosphor bronze and the tinning layer. Generally, the thickness of this middle alloy layer is 0.3 μm to 0.7 μm immediately after the tinning process, and is excellent in the adhesion of the base material and the tinning layer.

The plating thickness can be selected according to the application
(Plating thickness 0.7 - 10 μm)Plating with very little occurrence of whiskersHighly reliable tinning layerUniform mirror surface

*Image of HOT-DIP tinning and phosphor bronze cross section (Magnification: 1000 times)
Plating thickness: 6 μm; Middle alloy layer: 0.5 μm
Outlook of HOT-DIP Tinning
Compared to electroplating, the occurrence of whiskers (single crystals in the shape of whiskers are generated from the film of the electrical tinning, which causes short circuits in electronic devices) is extremely low in HOT-DIP tinning, and the adhesion with the base metal is extremely secure and excellent in bendability. Therefore, HOT-DIP tinning has been accepted as being highly reliable, particularly as a material for compact high density parts.
Since this tinned material has an extremely stable film layer, it solves problems in processes accompanying the diversification and miniaturization of parts. As a result of improving the reliability of parts, HOT-DIP tinned material is expanding worldwide as a global metallic material which corresponds to quality improvements in any part.
The characteristics of HOT-DIP tinning are excellent in corrosion resistance and solderability; therefore, it has been used extensively in automobiles, electrical and electronic components since the 1970s in Europe and the U.S., and in recent years, it has been used by Japanese automobile manufacturers as well.
By the metallic bonding between the melted tin and phosphor bronze, a middle alloy layer which completely covers the base material is formed between the base phosphor bronze and the tinning layer. Generally, the thickness of this middle alloy layer is 0.3 μm to 0.7 μm immediately after the tinning process, and is excellent in the adhesion of the base material and the tinning layer.

The plating thickness can be selected according to the application
(Plating thickness 0.7 - 10 μm)Plating with very little occurrence of whiskersHighly reliable tinning layerUniform mirror surface

*Image of HOT-DIP tinning and phosphor bronze cross section (Magnification: 1000 times)
Plating thickness: 6 μm; Middle alloy layer: 0.5 μm
Outlook of HOT-DIP Tinning
Compared to electroplating, the occurrence of whiskers (single crystals in the shape of whiskers are generated from the film of the electrical tinning, which causes short circuits in electronic devices) is extremely low in HOT-DIP tinning, and the adhesion with the base metal is extremely secure and excellent in bendability. Therefore, HOT-DIP tinning has been accepted as being highly reliable, particularly as a material for compact high density parts.
Since this tinned material has an extremely stable film layer, it solves problems in processes accompanying the diversification and miniaturization of parts. As a result of improving the reliability of parts, HOT-DIP tinned material is expanding worldwide as a global metallic material which corresponds to quality improvements in any part.
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