Archtectue of water cooling system for cpu
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Computer cooling is required to remove the waste heat produced by computer components, to keep components within permissible operating temperature limits. Components that are susceptible to temporary malfunction or permanent failure if overheated include integrated circuits such as central processing units (CPUs), chipset, graphics cards, and hard disk drives.
A finned air cooled heatsink with fan clipped onto a microprocessor, with a smaller passive heatsink without fan in the background.A 3-fan heatsink mounted on a graphics card to maximize cooling efficiency of the GPU and surrounding components.Commodore 128DCR computer's switch-mode power supply, with a user-installed 40 mm cooling fan. Vertical aluminium profiles are used as heatsinks.
Components are often designed to generate as little heat as possible, and computers and operating systems may be designed to reduce power consumption and consequent heating according to workload, but more heat may still be produced than can be removed without attention to cooling. Use of heatsinks cooled by airflow reduces the temperature rise produced by a given amount of heat. Attention to patterns of airflow can prevent the development of hotspots. Computer fans are widely used along with heatsink fans to reduce temperature by actively exhausting hot air. There are also more exotic cooling techniques, such as liquid cooling. All modern day processors are designed to cut out or reduce their voltage or clock speed if the internal temperature of the processor exceeds a specified limit.
Cooling may be designed to reduce the ambient temperature within the case of a computer, such as by exhausting hot air, or to cool a single component or small area (spot cooling). Components commonly individually cooled include the CPU, Graphics processing unit (GPU) and the northbridge.
Generators of unwanted heat
Integrated circuits (e.g., CPU and GPU) are the main generators of heat in modern computers. Heat generation can be reduced by efficient design and selection of operating parameters such as voltage and frequency, but ultimately, acceptable performance can often only be achieved by managing significant heat generation.
The dust buildup on this laptop CPU heat sink after three years of use has made the laptop unusable due to frequent thermal shutdowns.
In operation, the temperature of a computer's components will rise until the heat transferred to the surroundings is equal to the heat produced by the component, that is, when thermal equilibrium is reached. For reliable operation, the temperature must never exceed a specified maximum permissible value unique to each component. For semiconductors, instantaneous junction temperature, rather than component case, heatsink, or ambient temperature is critical.
Cooling can be changed by:
Dust acting as a thermal insulator and impeding airflow, thereby reducing heat sink and fan performance.
Poor airflow including turbulence due to friction against impeding components such as ribbon cables, or incorrect orientation of fans, can reduce the amount of air flowing through a case and even create localized whirlpools of hot air in the case. In some cases of equipment with bad thermal design, cooling air can easily flow out through "cooling" holes before passing over hot components; cooling in such cases can often be improved by blocking of selected holes.
Poor heat transfer due to poor thermal contact between components to be cooled and cooling devices. This can be improved by the use of thermal compounds to even out surface imperfections, or even by lapping.
Damage prevention
Because high temperatures can significantly reduce life span or cause permanent damage to components, and the heat output of components can sometimes exceed the computer's cooling capacity, manufacturers often take additional precautions to ensure that temperatures remain within safe limits. A computer with thermal sensors integrated in the CPU, motherboard, chipset, or GPU can shut itself down when high temperatures are detected to prevent permanent damage, although this may not completely guarantee long-term safe operation. Before an overheating component reaches this point, it may be "throttled" until temperatures fall below a safe point using dynamic frequency scaling technology. Throttling reduces the operating frequency and voltage of an integrated circuit or disables non-essential features of the chip to reduce heat output, often at the cost of slightly or significantly reduced performance. For desktop and notebook computers, throttling is often controlled at the BIOS level. Throttling is also commonly used to manage temperatures in smartphones and tablets, where components are packed tightly together with little to no active cooling, and with additional heat transferred from the hand of the user.
Your perfect answer bro
A finned air cooled heatsink with fan clipped onto a microprocessor, with a smaller passive heatsink without fan in the background.A 3-fan heatsink mounted on a graphics card to maximize cooling efficiency of the GPU and surrounding components.Commodore 128DCR computer's switch-mode power supply, with a user-installed 40 mm cooling fan. Vertical aluminium profiles are used as heatsinks.
Components are often designed to generate as little heat as possible, and computers and operating systems may be designed to reduce power consumption and consequent heating according to workload, but more heat may still be produced than can be removed without attention to cooling. Use of heatsinks cooled by airflow reduces the temperature rise produced by a given amount of heat. Attention to patterns of airflow can prevent the development of hotspots. Computer fans are widely used along with heatsink fans to reduce temperature by actively exhausting hot air. There are also more exotic cooling techniques, such as liquid cooling. All modern day processors are designed to cut out or reduce their voltage or clock speed if the internal temperature of the processor exceeds a specified limit.
Cooling may be designed to reduce the ambient temperature within the case of a computer, such as by exhausting hot air, or to cool a single component or small area (spot cooling). Components commonly individually cooled include the CPU, Graphics processing unit (GPU) and the northbridge.
Generators of unwanted heat
Integrated circuits (e.g., CPU and GPU) are the main generators of heat in modern computers. Heat generation can be reduced by efficient design and selection of operating parameters such as voltage and frequency, but ultimately, acceptable performance can often only be achieved by managing significant heat generation.
The dust buildup on this laptop CPU heat sink after three years of use has made the laptop unusable due to frequent thermal shutdowns.
In operation, the temperature of a computer's components will rise until the heat transferred to the surroundings is equal to the heat produced by the component, that is, when thermal equilibrium is reached. For reliable operation, the temperature must never exceed a specified maximum permissible value unique to each component. For semiconductors, instantaneous junction temperature, rather than component case, heatsink, or ambient temperature is critical.
Cooling can be changed by:
Dust acting as a thermal insulator and impeding airflow, thereby reducing heat sink and fan performance.
Poor airflow including turbulence due to friction against impeding components such as ribbon cables, or incorrect orientation of fans, can reduce the amount of air flowing through a case and even create localized whirlpools of hot air in the case. In some cases of equipment with bad thermal design, cooling air can easily flow out through "cooling" holes before passing over hot components; cooling in such cases can often be improved by blocking of selected holes.
Poor heat transfer due to poor thermal contact between components to be cooled and cooling devices. This can be improved by the use of thermal compounds to even out surface imperfections, or even by lapping.
Damage prevention
Because high temperatures can significantly reduce life span or cause permanent damage to components, and the heat output of components can sometimes exceed the computer's cooling capacity, manufacturers often take additional precautions to ensure that temperatures remain within safe limits. A computer with thermal sensors integrated in the CPU, motherboard, chipset, or GPU can shut itself down when high temperatures are detected to prevent permanent damage, although this may not completely guarantee long-term safe operation. Before an overheating component reaches this point, it may be "throttled" until temperatures fall below a safe point using dynamic frequency scaling technology. Throttling reduces the operating frequency and voltage of an integrated circuit or disables non-essential features of the chip to reduce heat output, often at the cost of slightly or significantly reduced performance. For desktop and notebook computers, throttling is often controlled at the BIOS level. Throttling is also commonly used to manage temperatures in smartphones and tablets, where components are packed tightly together with little to no active cooling, and with additional heat transferred from the hand of the user.
Your perfect answer bro
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