Basic principle of thermogravimetric analysis (tga)
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: The thermoelectric semiconductor material most often used in today’s TE coolers is an alloy of Bismuth Telluride that has been suitably doped to provide individual blocks or elements having distinct “N” and “P” characteristics. Thermoelectric materials most often are fabricated by either directional crystallization from a melt or pressed powder metallurgy. Each manufacturing method has its own particular advantage, but directionally grown materials are most common. In addition to Bismuth Telluride (Bi2Te3), there are other thermoelectric materials including Lead Telluride (PbTe), Silicon Germanium (SiGe), and Bismuth-Antimony (Bi-Sb) alloys that may be used in specific situations. Figure (2.1) illustrates the relative performance or Figure-of-Merit of various materials over a range of temperatures.
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A TGA analysis is performed by gradually raising the temperature of a sample in a furnace as its weight is measured on an analytical balance that remains outside of the furnace. In TGA, mass loss is observed if a thermal event involves loss of a volatile component.
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