Chemical mechanical planarization of microelectronic materials
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chemical mechanical planarization is a critical process for producing nearly perfect surfaces that are necessary for the most innovative and unique integrated circuits currently in production .Abrasive slurries are used in conjunction with a polishing apparatus to achieve the desired uniformity . Once polishing is complete, the residues left bend from CMP must be cleared . Aqueous cleaning solutions available from walo chemicals USA , INC have Been shown to be highly effective post - CMP cleaning agents
◆ several pH variations
● customizable to FAB specifications
◆ corrosion protection
●oxidation-reduction control
● galvanic
◆ High degree of BTA removal
◆ suitable for cu,co, w , others
• manufactured in Japan ( several sites) and Richmond 5A
◆ several pH variations
● customizable to FAB specifications
◆ corrosion protection
●oxidation-reduction control
● galvanic
◆ High degree of BTA removal
◆ suitable for cu,co, w , others
• manufactured in Japan ( several sites) and Richmond 5A
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