Question

Describe in detail Advancement in packaging.

Answer 1

$\huge\bold{\purple{ANSWER}}$

With an emphasis on new technologies, the IC packaging and design industry continues to experience accelerated growth while materials suppliers invest their resources into delivering market-ready materials. Recent innovations include Wafer Backside Coating Technology (WBC), compression mold materials, electrically conductive adhesives for assembly of photovoltaic modules, thermo-compression flip-chip and epoxy flux technology for improved reliability solder interconnections.

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