Physics, asked by zafardr350, 9 months ago

describe the process of metallic bonding among the aggregate of copper atoms

Answers

Answered by randhirsinghrana13
2

Answer:

SUSS MicroTec wafer bonding equipment for lab, university and full production. ISO 9001 certified. Semiconductor Equipment. 60 years of experience. ISO 14001 certified.

Explanation:

MARK ME AS BRAINLIST AND FOLLOW ME

Similar questions