Question

In the silver plating of copper, K[Ag(CN)₂] is used instead
of AgNO₃. The reason is
(a) a thin layer of Ag is formed on Cu
(b) more voltage is required
(c) Ag⁺ ions are completely removed from solution
(d) less availability of Ag⁺ ions, as Cu cannot displace Ag
from [Ag(CN)₂]⁻ ion

Answer 1

Answer:

a) a thin layer of Ag is formed on Cu

Answer 2

(d) less availability of Ag⁺ ions, as Cu cannot displace Ag

from [Ag(CN)₂]⁻ ion

Explanation:

Cu + 2AgNO₃ ------------> Cu(NO₃)₂ + Ag

Copper is more electropositive than silver, so it readily precipitate silver from their salt (Ag+) solution. So AgNO₃ cannot be used in silver plating process of copper.

In k[Ag(CN)₂] solution, a complex anion is formed which is [Ag(CN)₂] because of this Ag₊ ions are less available in the solution and Cu cannot displace Ag from this complex ion.

More Question:

Some reactions of amines are given. Which one is not  correct ? [NEET Kar. 2013]

(a) (CH₃)₂NH + NaNO₂ + HCl → (CH₃)₂ N – N = O

(b) (CH₃)₂N – + NaNO₂ + HCl →

(CH₃)₂N⁻ – N = NCl

(c) CH₃CH₂NH₂ + HNO₂ → CH₃CH₂OH + N₂

(d) CH₃NH₂ + C₆H₅SO₂Cl → CH₃NHSO₂C₆H₅

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