Package-induced cross-coupling effect on amplifier harmonic suppression
Answers
Answered by
0
The objective of this work was to understand the fundamental physics of extremely high frequency RF
effects on electronics. To accomplish this objective, we produced models, conducted simulations, and
performed measurements to identify the mechanisms of effects as frequency increases into the
millimeter-wave regime. Our purpose was to answer the questions, “What are the tradeoffs between
coupling, transmission losses, and device responses as frequency increases?”, and, “How high in
frequency do effects on electronic systems continue to occur?” Using full wave electromagnetics codes
and a transmission-line/circuit code, we investigated how extremely high-frequency RF propagates on
wires and printed circuit board traces. We investigated both field-to-wire coupling and direct
illumination of printed circuit boards to determine the significant mechanisms for inducing currents at
device terminals. We measured coupling to wires and attenuation along wires for comparison to the
simulations, looking at plane-wave coupling as it launches modes onto single and multiconductor
structures. We simulated the response of discrete and integrated circuit semiconductor devices to those
high-frequency currents and voltages, using SGFramework, the open-source General-purpose
Semiconductor Simulator (gss), and Sandia‟s Charon semiconductor device physics codes. This report
documents our findings.
effects on electronics. To accomplish this objective, we produced models, conducted simulations, and
performed measurements to identify the mechanisms of effects as frequency increases into the
millimeter-wave regime. Our purpose was to answer the questions, “What are the tradeoffs between
coupling, transmission losses, and device responses as frequency increases?”, and, “How high in
frequency do effects on electronic systems continue to occur?” Using full wave electromagnetics codes
and a transmission-line/circuit code, we investigated how extremely high-frequency RF propagates on
wires and printed circuit board traces. We investigated both field-to-wire coupling and direct
illumination of printed circuit boards to determine the significant mechanisms for inducing currents at
device terminals. We measured coupling to wires and attenuation along wires for comparison to the
simulations, looking at plane-wave coupling as it launches modes onto single and multiconductor
structures. We simulated the response of discrete and integrated circuit semiconductor devices to those
high-frequency currents and voltages, using SGFramework, the open-source General-purpose
Semiconductor Simulator (gss), and Sandia‟s Charon semiconductor device physics codes. This report
documents our findings.
Similar questions