Question

Physical vapor deposition vs chemical vapor deposition

Answer 1

PVD (Physical Vapor Deposition) and CVD (Chemical Vapor Deposition) are two techniques that are used to create a very thin layer of material into a substrate; commonly referred to as thin films. They are used largely in the production of semiconductors where very thin layers of n-type and p-type materials create the necessary junctions. The main difference between PVD and CVD is the processes they employ.  As you may have already deduced from the names, PVD only uses physical forces to deposit the layer while CVD uses chemical processes.