Pick the odd one out and give reason
a. Heat sink b. Base plate
c. Soldering flux d. Diffuser cup
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what is the question tell me
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a)A heat sink is designed to maximize its surface area in contact with the cooling medium surrounding it, such as the air. ... Thermal adhesive or thermal paste improve the heat sink's performance by filling air gaps between the heat sink and the heat spreader on the device.b)
Base plates are included at the bottom of every rack upright in order to provide a connection point for the anchor bolts between the column and concrete slab when the anchors are drilled into the floor.
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