spin and parity of carbon
Answers
Answer:In an integrated circuit manufacturing process, spin-on-carbon (SOC) materials constitute an important layer for the multilayer process to achieve smaller feature size. The SOC layer responds to the photolithography, pattern transformation, substrate planarization, and a variety of other critical processes.
A key challenge in selecting a suitable material is that some processes require a high temperature, reaching as high as 300°C to 500°C, and most polymers decompose at these high temperatures. There are a few platforms that can survive, but these materials present challenges of their own. These types of materials that have high-temperature-stable polymers usually have poor solubility in commonly used organic solvents. Polymer types that are good for thermal stability often do not have good for gap fill or planarization. The SOC layer also must avoid both intermixing with the top layer and maintain line-wiggling resistance during pattern transfer etch.
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