Question

The method of electroplating copper by using copper sulphate solution is shown in the given figure.
Choose the correct statement among the following which takes place here
A) During electroplating, the copper gets deposited on plate B
B) During electroplating, the copper gets deposited on plate A
C) the amount of copper present in the solution decreases continuously,
D) None of the above​

Answer 1

Answer:

b is the answer

Explanation:

yes B is the answer

Answer 2

Answer:

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