what are 3 d packing
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it refers to 3d integration that rely on traditional methods of interconnect such as wire bonding and flip chip to achieve vertical stacks
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3D Packaging refers to 3D integration schemes that rely on traditional methods of interconnect such as wire bonding and flip chip to achieve vertical stacks. ... As of the 2010s, 3D IC packages are widely used for NAND flash memory in mobile devices.
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