What is the impact of bga on board design and manufacturing?
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Answer:
Along with the fast development of very large scale integrated circuits (ICs), electronics assembly demands can never be met by traditional package types and newer packages come into being due to the encouragement of demands in terms of higher integrity, smaller board size and higher I/O count. Among all the newer types of packages mentioned above, BGA (ball grid array) package is a primary type with the widest application fields due to its diversity defeating multiple limitations featured by traditional packages. From the perspective of elements concerning soldering technologies, BGA package is hardly different from traditional packages, QFP (quad flat package) for example. Nevertheless, pins are replaced by solder balls, which can be regarded as a revolution in electronics assembly and brings forward the advent of derivative packages such as CSP (chip scale package). Right now, BGA soldering has still to be implemented with traditional SMT (surface mount technology) applied and BGA soldering can still be carried out in ordinary SMT assembly equipment. This article will discuss some factors affecting the application of BGA assembly technologies including BGA pad design, solder paste printing, mounting alignment accuracy, soldering temperature curves and soldering