CBSE BOARD X, asked by manojwishwakarm4296, 4 days ago

Which is alternative to ceramic SMD IC packages? | * 2

Answers

Answered by palaksoni5274

0

Answer:

The Common IC Packaging Types

DIP (Double In-line Package)

SOP/SOIC/SO (Small Outline Package)

QFP (Quad Flat Package)

QFN/LCC (Quad Flat Non-leaded Package)

BGA (Ball Grid Array Package)

CSP (Chip Scale Package)

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