Question

write about hot pin test

Answer 1

The adhesion test of metallic structures on MID (Molded Interconnect Devices) parts is an unsolved issue. So far no method really works reliably. The test methods which are conventionally used are the pull-off test and the shear-test. Both show large standard deviation and the reproducibility is not assured. Nordson DAGE has introduced the new micro-material testing system 4000Plus. This device enables a new test method for the determination of the adhesion strength of MID structures using the hot pin pull (hot bump pull) method. Copper pins (tinned or untinned) are heated up with a user defined temperature profile, soldered to a metallized structure on the MID and then removed vertically upward, while the force is recorded. In this contribution investigations with this new test method are presented.

Answer 2

INIT is a hot reset input pin of the Pentium processor, which means an input to that pin can reset the processor, without initializing the caches, write-back buffers, and floating point registers. Further, at the time of power-on, if the INIT pin is made 1, while the RESET pinchanges from 1 to 0, then the built-in-self-test program will be executed.