Define BGA and its type
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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package.
Types of BGA
Dual in-line package (DIP)
Pin grid array (PGA)
Land grid array (LGA)
Thin quad flat pack (TQFP)
Small-outline integrated circuit (SOIC)
Chip carrier Chip packaging and package types list.
Embedded Wafer Level Ball Grid Array.
Hope this answer will help you!!
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package.
Types of BGA
Dual in-line package (DIP)
Pin grid array (PGA)
Land grid array (LGA)
Thin quad flat pack (TQFP)
Small-outline integrated circuit (SOIC)
Chip carrier Chip packaging and package types list.
Embedded Wafer Level Ball Grid Array.
Hope this answer will help you!!
Answered by
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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package.
A Brief Introduction of BGA Package Types
PBGA, short for plastic ball grid array, was invented by Motorola and now has received the widest focus and applications. ...
As is its name defined, CBGA (ceramic ball grid array) packages take advantage of ceramic as substrate material and tin balls (ratio between tin and lead: 10:90) with high melting point.
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