Question

During preparation of paste what component is adde to create cooling effect during application

Answer 1

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Answer:

Thermal paste (also called thermal compound, thermal grease, thermal interface material (TIM), thermal gel, heat paste, heat sink compound, heat sink paste or CPU grease) is a thermally conductive (but usually electrically insulating) chemical compound, which is commonly used as an interface between heat sinks and heat sources such as high-power semiconductor devices. The main role of thermal paste is to eliminate air gaps or spaces (which act as thermal insulation) from the interface area in order to maximize heat transfer and dissipation. Thermal paste is an example of a thermal interface material.

As opposed to thermal adhesive, thermal paste does not add mechanical strength to the bond between heat source and heat sink. It will have to be coupled with a mechanical fixation mechanism such as screws, applying pressure between the two, spreading the thermal paste onto the heat source.

Answer 2

Answer:

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Explanation:

Thermal paste (also called thermal compound, thermal grease, thermal interface material (TIM), thermal gel, heat paste, heat sink compound, heat sink paste or CPU grease) is a thermally conductive (but usually electrically insulating) chemical compound, which is commonly used as an interface between heat sinks and heat sources such as high-power semiconductor devices. The main role of thermal paste is to eliminate air gaps or spaces (which act as thermal insulation) from the interface area in order to maximize heat transfer and dissipation. Thermal paste is an example of a thermal interface material.

As opposed to thermal adhesive, thermal paste does not add mechanical strength to the bond between heat source and heat sink. It will have to be coupled with a mechanical fixation mechanism such as screws, applying pressure between the two, spreading the thermal paste onto the heat source

.Thermal paste consists of a polymerizable liquid matrix and large volume fractions of electrically insulating, but thermally conductive filler.

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