Question

Write note on advanced trends in RF chip design.

Answer 1

Abstract

This paper overviews the RF&Wireless packaging

trends and introduces the four major impact areas

Methodology and systems modeling , Board, assembly

and housing, Prototyping, processing and production,

Characterization on hand of real life examples. As an

outview the major present trend of heterointegration and

the picture of packaging waves is used to look into near future.

In an age of borderless communication, with ubiquitous